V58C2256164SHLM4I
vs
MT46V8M16FJ-75EL:A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PROMOS TECHNOLOGIES INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TBGA,
TBGA,
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.02
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Length
13 mm
16 mm
Memory Density
268435456 bit
134217728 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
8388608 words
Number of Words Code
16000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
9 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
JESD-609 Code
e0
Refresh Cycles
4096
Supply Current-Max
0.135 mA
Terminal Finish
TIN LEAD SILVER
Compare V58C2256164SHLM4I with alternatives
Compare MT46V8M16FJ-75EL:A with alternatives