V55C2128164VAC10
vs
K4M28163LF-RC1H0
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PROMOS TECHNOLOGIES INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA54,9X9,32
VFBGA,
Pin Count
54
54
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
7 ns
7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
JESD-30 Code
S-PBGA-B54
S-PBGA-B54
JESD-609 Code
e0
e0
Length
8 mm
8 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
8MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Equivalence Code
BGA54,9X9,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Seated Height-Max
1.2 mm
1 mm
Self Refresh
YES
YES
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.00001 A
Supply Current-Max
0.19 mA
Supply Voltage-Max (Vsup)
2.9 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Compare V55C2128164VAC10 with alternatives
Compare K4M28163LF-RC1H0 with alternatives