V380SDC
vs
F82C212
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
V3 SEMICONDUCTOR
|
CHIPS AND TECHNOLOGIES INC
|
Part Package Code |
QFP
|
|
Package Description |
QFP,
|
|
Pin Count |
100
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
Number of Terminals |
100
|
100
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
1
|
1
|
|
|
|
Compare V380SDC with alternatives
Compare F82C212 with alternatives