V380SDC
vs
DP8441VLJ-25
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
V3 SEMICONDUCTOR
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
|
Package Description |
QFP,
|
QFP, QFP100,.7X.9
|
Pin Count |
100
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
Number of Terminals |
100
|
100
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
No
|
Address Bus Width |
|
26
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
25 MHz
|
External Data Bus Width |
|
|
JESD-609 Code |
|
e0
|
Length |
|
20 mm
|
Low Power Mode |
|
NO
|
Memory Organization |
|
64M X 1
|
Number of Banks |
|
4
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
QFP100,.7X.9
|
Seated Height-Max |
|
3 mm
|
Supply Current-Max |
|
260 mA
|
Supply Voltage-Max |
|
5.25 V
|
Supply Voltage-Min |
|
4.75 V
|
Supply Voltage-Nom |
|
5 V
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
0.65 mm
|
Width |
|
14 mm
|
|
|
|
Compare V380SDC with alternatives
Compare DP8441VLJ-25 with alternatives