UZ810HR2 vs MX1N5347BTR feature comparison

UZ810HR2 Microsemi Corporation

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MX1N5347BTR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 4 Ω
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 3 W 5 W
Qualification Status Not Qualified
Reference Voltage-Nom 10 V 10 V
Reverse Current-Max 40 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 6 mV/°C
Voltage Tol-Max 10% 5%
Working Test Current 75 mA 125 mA
Base Number Matches 1 1
Pbfree Code No
Package Description O-PALF-W2
Pin Count 2
Moisture Sensitivity Level 1
Reference Standard MIL-19500

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Compare MX1N5347BTR with alternatives