UZ7813
vs
1N2977R
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NEW ENGLAND SEMICONDUCTOR
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-MUPM-X1
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
10 W
|
10 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
13 V
|
13 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
UNSPECIFIED
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Voltage Tol-Max |
10%
|
20%
|
| Working Test Current |
200 mA
|
190 mA
|
| Base Number Matches |
4
|
9
|
| Package Description |
|
HERMETIC SEALED, DO-4, 1 PIN
|
| Dynamic Impedance-Max |
|
3 Ω
|
| JEDEC-95 Code |
|
DO-4
|
| Knee Impedance-Max |
|
250 Ω
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
10 µA
|
| Voltage Temp Coeff-Max |
|
8.45 mV/°C
|
|
|
|
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