UT54ACTS10PQXH
vs
5962H9652101QCC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
DIP
Package Description
DIP,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
JESD-30 Code
R-CDIP-T14
R-XDIP-T14
Length
19.43 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
16 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
4
Load Capacitance (CL)
50 pF
Max I(ol)
0.008 A
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
16 ns
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Total Dose
1M Rad(Si) V
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