UT1750AR16WSCR
vs
NG80386DXL-25F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
ADVANCED MICRO DEVICES INC
Part Package Code
QFP
QFP
Package Description
QFF,
GQFF, TPAK132,1.8SQ,25
Pin Count
132
132
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
16
30
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
50 MHz
External Data Bus Width
16
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CQFP-F132
S-PQFP-F132
Length
24.13 mm
24.0792 mm
Low Power Mode
NO
YES
Number of Terminals
132
132
Operating Temperature-Max
125 °C
100 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QFF
GQFF
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, GUARD RING
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
2.794 mm
4.8 mm
Speed
16 MHz
25 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Form
FLAT
FLAT
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
QUAD
QUAD
Total Dose
100k Rad(Si) V
Width
24.13 mm
24.0792 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
1
Rohs Code
JESD-609 Code
e0
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code
TPAK132,1.8SQ,25
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
RAM (words)
0
Supply Current-Max
250 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare UT1750AR16WSCR with alternatives
Compare NG80386DXL-25F with alternatives