UT1750AR12FCC vs NG80960JT-100 feature comparison

UT1750AR12FCC Cobham Semiconductor Solutions

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NG80960JT-100 Intel Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer AEROFLEX COLORADO SPRINGS INTEL CORP
Part Package Code QFP QFP
Package Description QFF, QFP, SPQFP132,1.1SQ
Pin Count 132 132
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01
Address Bus Width 16 32
Bit Size 16 32
Boundary Scan NO YES
Clock Frequency-Max 12 MHz 33.3 MHz
External Data Bus Width 16 32
Format FLOATING POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-CQFP-F132 S-PQFP-G132
Length 24.13 mm 24.13 mm
Low Power Mode YES YES
Number of Terminals 132 132
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QFF QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.794 mm 4.57 mm
Speed 12 MHz 100 MHz
Supply Voltage-Max 5.5 V 3.45 V
Supply Voltage-Min 4.5 V 3.15 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form FLAT GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Width 24.13 mm 24.13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Rohs Code No
Factory Lead Time 4 Weeks
Additional Feature BURST BUS
Package Equivalence Code SPQFP132,1.1SQ
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 3.3,3.3/5 V
Supply Current-Max 600 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare UT1750AR12FCC with alternatives

Compare NG80960JT-100 with alternatives