USB7002-I/KDXVAO vs USB5734/MR feature comparison

USB7002-I/KDXVAO Microchip Technology Inc

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USB5734/MR Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Date Of Intro 2019-02-20
Samacsys Manufacturer Microchip Microchip
Additional Feature ALSO OPERATES WITH 3.3V SUPPLY
Bus Compatibility I2C; I2S; SMBUS; SPI; UART; USB I2C; SMBUS; SPI; UART; USB
Clock Frequency-Max 25 MHz 25 MHz
Data Transfer Rate-Max 625 MBps 625 MBps
JESD-30 Code S-PQCC-N100 S-PQCC-N64
Length 12 mm 9 mm
Number of Terminals 100 64
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC100,.47SQ,16 LCC64,.35SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level AEC-Q100
Seated Height-Max 0.9 mm 1 mm
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.08 V 1.08 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position QUAD QUAD
Width 12 mm 9 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches 1 1
Package Description HVQCCN, LCC64,.35SQ,20
Factory Lead Time 5 Weeks
Address Bus Width
External Data Bus Width
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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