USB5807/KD
vs
GL3523-OTY10
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
GENESYS LOGIC INC
|
Package Description |
VQFN-100
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2016-10-03
|
|
Samacsys Manufacturer |
Microchip
|
|
Bus Compatibility |
I2C; SMBUS; SPI
|
I2C; SPI; SMBUS
|
Clock Frequency-Max |
25 MHz
|
|
Data Transfer Rate-Max |
625 MBps
|
60 MBps
|
JESD-30 Code |
S-XQCC-N100
|
S-XQCC-N76
|
JESD-609 Code |
e3
|
|
Length |
12 mm
|
9 mm
|
Number of Terminals |
100
|
76
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC100,.47SQ,16
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Supply Voltage-Max |
1.32 V
|
1.32 V
|
Supply Voltage-Min |
1.08 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
25MHZ NOMINAL FREQUENCY AVAILABLE
|
Address Bus Width |
|
|
External Data Bus Width |
|
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare USB5807/KD with alternatives
Compare GL3523-OTY10 with alternatives