USB3321C-GL-TR
vs
USB3321C-GL-TR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA, BGA25,5X5,16
|
WLCSP-25
|
Pin Count |
25
|
25
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Clock Frequency-Max |
26 MHz
|
27 MHz
|
JESD-30 Code |
S-PBGA-B25
|
S-PBGA-B25
|
Length |
1.97 mm
|
1.97 mm
|
Number of Terminals |
25
|
25
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA25,5X5,16
|
BGA25,5X5,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.62 mm
|
0.62 mm
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
1.97 mm
|
1.97 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
10 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Bus Compatibility |
|
UART; USB
|
External Data Bus Width |
|
7
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
1
|
Screening Level |
|
TS 16949
|
Supply Current-Max |
|
29.4 mA
|
Supply Voltage-Max |
|
2 V
|
Supply Voltage-Min |
|
1.6 V
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
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