USB2517I-JZX-CAG
vs
CY7C65620-56LFXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Package Description
QFN-64
8 X 8 MM, 1 MM HEIGHT, MO-220, QFN-56
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.3
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 3.3 V
Address Bus Width
Bus Compatibility
I2C; SMBUS; VBUS
Clock Frequency-Max
24 MHz
24 MHz
Data Transfer Rate-Max
60 MBps
External Data Bus Width
JESD-30 Code
S-XQCC-N64
S-XQCC-N56
Length
9 mm
8 mm
Number of Terminals
64
56
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level
TS 16949
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max
1.98 V
3.45 V
Supply Voltage-Min
1.62 V
3.15 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
9 mm
8 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
1
2
Rohs Code
Yes
Part Package Code
QFN
Pin Count
56
JESD-609 Code
e3
Moisture Sensitivity Level
3
Package Equivalence Code
LCC56,.31SQ,20
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Supply Current-Max
190 mA
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare USB2517I-JZX-CAG with alternatives
Compare CY7C65620-56LFXC with alternatives