USB2517-JZX-TR
vs
USB2514B-AEZ
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STANDARD MICROSYSTEMS CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
9 X 9 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-64
|
6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-36
|
| Pin Count |
64
|
36
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.3
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
54 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ALSO OPERATES AT 3.3 V
|
|
| Address Bus Width |
|
|
| Bus Compatibility |
I2C; SMBUS; USB
|
I2C; SMBUS
|
| Clock Frequency-Max |
24 MHz
|
24 MHz
|
| Data Transfer Rate-Max |
60 MBps
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-XQCC-N36
|
| JESD-609 Code |
e3
|
|
| Length |
9 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
64
|
36
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
1.98 V
|
3.6 V
|
| Supply Voltage-Min |
1.62 V
|
3 V
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
2
|
|
|
|
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