USB2517-JZX
vs
USS2X1W
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
BROADCOM INC
|
Part Package Code |
QFN
|
|
Package Description |
9 X 9 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-64
|
TQFP-64
|
Pin Count |
64
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bus Compatibility |
I2C
|
|
Clock Frequency-Max |
24 MHz
|
30 MHz
|
External Data Bus Width |
|
16
|
JESD-30 Code |
S-XQCC-N64
|
S-PQFP-G64
|
Length |
9 mm
|
10 mm
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.6 mm
|
Supply Voltage-Max |
3.6 V
|
3.465 V
|
Supply Voltage-Min |
3 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
9 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
2
|
3
|
ECCN Code |
|
3A991.A.2
|
Data Transfer Rate-Max |
|
60 MBps
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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