USB2514B-AEZC
vs
USB2514BI-AEZG-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-36
|
QFN-36
|
| Pin Count |
36
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bus Compatibility |
I2C
|
I2C; SMBUS; USB
|
| Clock Frequency-Max |
24 MHz
|
24 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N36
|
S-PQCC-N36
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
36
|
36
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
6 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Package Equivalence Code |
|
LCC36,.24SQ,20
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare USB2514B-AEZC with alternatives
Compare USB2514BI-AEZG-TR with alternatives