USB20H04-JD
vs
CY7C65620-56LTXIT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STANDARD MICROSYSTEMS CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
QFN
Package Description
LFQFP,
QFN-56
Pin Count
64
56
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
Clock Frequency-Max
24 MHz
24 MHz
Data Transfer Rate-Max
0.0125 MBps
External Data Bus Width
JESD-30 Code
S-PQFP-G64
S-XQCC-N56
JESD-609 Code
e0
e4
Length
10 mm
8 mm
Moisture Sensitivity Level
3
3
Number of Terminals
64
56
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LFQFP
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
235
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1 mm
Supply Voltage-Max
2 V
3.45 V
Supply Voltage-Min
1.74 V
3.15 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
8 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
1
2
ECCN Code
5A991.B.4.B
Package Equivalence Code
LCC56,.31SQ,20
Supply Current-Max
260 mA
Time@Peak Reflow Temperature-Max (s)
30
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