US1D vs US1DR3G feature comparison

US1D NXP Semiconductors

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US1DR3G Taiwan Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TAIWAN SEMICONDUCTOR CO LTD
Part Package Code DO-214AC
Package Description PLASTIC PACKAGE-2 GREEN, PLASTIC, SMA, 2 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Additional Feature LOW LEAKAGE CURRENT
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V
JEDEC-95 Code DO-214AC DO-214AC
JESD-30 Code R-PDSO-C2 R-PDSO-C2
Non-rep Pk Forward Current-Max 25 A 30 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Output Current-Max 1 A 1 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 200 V 200 V
Reverse Recovery Time-Max 0.05 µs 0.05 µs
Surface Mount YES YES
Technology AVALANCHE
Terminal Form C BEND C BEND
Terminal Position DUAL DUAL
Base Number Matches 35 1
Application GENERAL PURPOSE
Case Connection UNSPECIFIED
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 250
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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