UPD70F3116GJ(A1)-UEN
vs
UPD70F3116GJ(A1)-UEN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
20 X 20 MM, FINE PITCH, PLASTIC, LQFP-144
|
| Pin Count |
144
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
20 mm
|
| Number of I/O Lines |
83
|
83
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
110 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
32 MHz
|
32 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
4
|
2
|
| Additional Feature |
|
ALSO REQUIRES 5V SUPPLY
|
|
|
|