UPD705100GJ-100-8EU-A
vs
SH7708
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
HITACHI LTD
|
| Package Description |
20 X 20 MM, FINE PITCH, PLASTIC, QFP-144
|
LFQFP, QFP144,.87SQ,20
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
100 MHz
|
60 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e6/e4
|
e0
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
144
|
144
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
1.7 mm
|
| Speed |
100 MHz
|
60 MHz
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN BISMUTH/NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
| Operating Temperature-Max |
|
75 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Equivalence Code |
|
QFP144,.87SQ,20
|
| Supply Current-Max |
|
195 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
|
|
|
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