UPD48576218FF-E24-DW1-A
vs
UPD48576218FF-E25-DW1-A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
End Of Life
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
TBGA, BGA144,12X18,40/32
TBGA, BGA144,12X18,40/32
Pin Count
144
144
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.3 ns
0.3 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
Clock Frequency-Max (fCLK)
400 MHz
400 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
Length
18.5 mm
18.5 mm
Memory Density
603979776 bit
603979776 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
32MX18
32MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA144,12X18,40/32
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.17 mm
1.17 mm
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.055 A
0.055 A
Supply Current-Max
0.872 mA
0.872 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Compare UPD48576218FF-E24-DW1-A with alternatives
Compare UPD48576218FF-E25-DW1-A with alternatives