UPD48576118FF-E33-DW1-A
vs
MT49H32M18CHU-25IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TBGA, BGA144,12X18,40/32
FBGA-144
Pin Count
144
144
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.25 ns
0.2 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
Clock Frequency-Max (fCLK)
300 MHz
400 MHz
I/O Type
SEPARATE
SEPARATE
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
Length
18.5 mm
18.5 mm
Memory Density
603979776 bit
603979776 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32MX18
32MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA144,12X18,40/32
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.17 mm
1.2 mm
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.055 A
0.048 A
Supply Current-Max
0.716 mA
0.97 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD SILVER
Compare UPD48576118FF-E33-DW1-A with alternatives
Compare MT49H32M18CHU-25IT with alternatives