UPD48288218AFF-E24-DW1-A
vs
GS4288C18L-25T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
GSI TECHNOLOGY
|
Part Package Code |
T-TFBGA
|
BGA
|
Package Description |
BGA, BGA144,12X18,40/32
|
TBGA,
|
Pin Count |
144
|
144
|
Manufacturer Package Code |
TTBG0144GA-A144
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A002
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Clock Frequency-Max (fCLK) |
400 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B144
|
R-PBGA-B144
|
JESD-609 Code |
e6
|
|
Memory Density |
301989888 bit
|
301989888 bit
|
Memory IC Type |
DDR1 DRAM
|
DDR DRAM
|
Memory Width |
18
|
18
|
Number of Terminals |
144
|
144
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Organization |
16MX18
|
16MX18
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TBGA
|
Package Equivalence Code |
BGA144,12X18,40/32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE
|
Qualification Status |
Not Qualified
|
|
Sequential Burst Length |
2,4,8
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN BISMUTH
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Access Mode |
|
MULTI BANK PAGE BURST
|
Additional Feature |
|
AUTO REFRESH
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Operating Mode |
|
SYNCHRONOUS
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
1.9 V
|
Supply Voltage-Min (Vsup) |
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Width |
|
11 mm
|
|
|
|
Compare UPD48288218AFF-E24-DW1-A with alternatives
Compare GS4288C18L-25T with alternatives