UPD48288118FF-E33-DW1-A
vs
GS4288S18L-18IT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TBGA,
|
TBGA,
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
| Additional Feature |
AUTO REFRESH
|
AUTO REFRESH
|
| JESD-30 Code |
R-PBGA-B144
|
R-PBGA-B144
|
| Length |
18.5 mm
|
|
| Memory Density |
301989888 bit
|
301989888 bit
|
| Memory IC Type |
DDR DRAM
|
DDR DRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Organization |
16MX18
|
16MX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
TBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.17 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare UPD48288118FF-E33-DW1-A with alternatives
Compare GS4288S18L-18IT with alternatives