UPD4481182GF-C50-A
vs
AS7C33512PFS18A-166TQI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LQFP,
LQFP, QFP100,.63X.87
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.2 ns
4 ns
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e6
e0
Length
20 mm
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX18
512KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.6 mm
Supply Voltage-Max (Vsup)
2.625 V
3.465 V
Supply Voltage-Min (Vsup)
2.375 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
2
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Standby Current-Max
0.03 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.475 mA
Compare UPD4481182GF-C50-A with alternatives
Compare AS7C33512PFS18A-166TQI with alternatives