UPD4481162GF-A60Y-A vs UPD4481161GF-C85 feature comparison

UPD4481162GF-A60Y-A NEC Electronics Group

Buy Now Datasheet

UPD4481161GF-C85 Renesas Electronics Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code QFP QFP
Package Description LQFP, LQFP,
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 8.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e6 e0
Length 20 mm 20 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max (Vsup) 3.465 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 3
Pbfree Code No
Rohs Code No

Compare UPD4481162GF-A60Y-A with alternatives

Compare UPD4481161GF-C85 with alternatives