UPD4481162GF-A50Y
vs
UPD4481162GF-A75
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NEC ELECTRONICS AMERICA INC
|
Reach Compliance Code |
unknown
|
compliant
|
Base Number Matches |
2
|
2
|
Package Description |
|
14 X 20 MM, PLASTIC, LQFP-100
|
Access Time-Max |
|
4.2 ns
|
Additional Feature |
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
|
R-PQFP-G100
|
JESD-609 Code |
|
e0
|
Length |
|
20 mm
|
Memory Density |
|
8388608 bit
|
Memory IC Type |
|
ZBT SRAM
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Terminals |
|
100
|
Number of Words |
|
524288 words
|
Number of Words Code |
|
512000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
512KX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LQFP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.7 mm
|
Supply Voltage-Max (Vsup) |
|
3.465 V
|
Supply Voltage-Min (Vsup) |
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
QUAD
|
Width |
|
14 mm
|
|
|
|
Compare UPD4481162GF-A50Y with alternatives
Compare UPD4481162GF-A75 with alternatives