UPD4481161GF-C85 vs UPD4481162GF-A60Y-A feature comparison

UPD4481161GF-C85 Renesas Electronics Corporation

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UPD4481162GF-A60Y-A NEC Electronics Group

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NEC ELECTRONICS CORP
Part Package Code QFP QFP
Package Description LQFP, LQFP,
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 3.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e6
Length 20 mm 20 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.625 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 3 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare UPD4481161GF-C85 with alternatives

Compare UPD4481162GF-A60Y-A with alternatives