UPD448012GY-B55X-MJH vs K6F8016V3A-TF700 feature comparison

UPD448012GY-B55X-MJH Renesas Electronics Corporation

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K6F8016V3A-TF700 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 TSOP2
Package Description TSOP1, TSSOP48,.71,20 TSOP2,
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G48 R-PDSO-G44
JESD-609 Code e0
Length 18 mm 18.4 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP2
Package Equivalence Code TSSOP48,.71,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL DUAL
Width 12 mm 10.16 mm
Base Number Matches 2 1

Compare UPD448012GY-B55X-MJH with alternatives

Compare K6F8016V3A-TF700 with alternatives