UPD44644094F5-E40-FQ1
vs
GS8662R09E-250T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Pin Count
165
165
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
DDR SRAM
Memory Width
9
9
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX9
8MX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
1
Package Description
LBGA,
Additional Feature
PIPELINED ARCHITECTURE
Length
17 mm
Moisture Sensitivity Level
3
Number of Functions
1
Peak Reflow Temperature (Cel)
235
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Width
15 mm
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