UPD44644094F5-E40-FQ1 vs CY7C1528V18-250BZI feature comparison

UPD44644094F5-E40-FQ1 Renesas Electronics Corporation

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CY7C1528V18-250BZI Cypress Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Pin Count 165 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Clock Frequency-Max (fCLK) 250 MHz 250 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM DDR SRAM
Memory Width 9 9
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8MX9 8MX9
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 1
Package Description 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Additional Feature PIPELINED ARCHITECTURE
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Number of Functions 1
Peak Reflow Temperature (Cel) 220
Seated Height-Max 1.4 mm
Standby Current-Max 0.38 A
Supply Current-Max 0.85 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Terminal Finish TIN LEAD
Width 15 mm

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