UPD4443362GF-A75
vs
MT58L128L36F1T-7.5
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LQFP,
PLASTIC, MS-026, TQFP-100
Pin Count
100
100
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.8 ns
7.5 ns
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e6/e4
e0
Length
20 mm
20 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
50 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN BISMUTH/NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
10
Width
14 mm
14 mm
Base Number Matches
1
3
Additional Feature
FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
113 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.375 mA
Compare UPD4443362GF-A75 with alternatives
Compare MT58L128L36F1T-7.5 with alternatives