UPD444016G5-12Y-7JF-A vs K6R4016C1B-TI12 feature comparison

UPD444016G5-12Y-7JF-A NEC Electronics Group

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K6R4016C1B-TI12 Samsung Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description TSOP2, TSOP2, TSOP44,.46,32
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3/e6 e0
Length 18.41 mm 18.41 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN/TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm 10.16 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code TSOP44,.46,32
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.255 mA

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