UPD444012AGY-C85X-MJH-A
vs
STK14CB16-RF25I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
SIMTEK CORP
|
Part Package Code |
TSOP1
|
|
Package Description |
TSOP1,
|
SOP,
|
Pin Count |
48
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
85 ns
|
25 ns
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e3/e6
|
e3
|
Length |
18 mm
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
NON-VOLATILE SRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Organization |
256KX16
|
256KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.2 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN/TIN BISMUTH
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
12 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare UPD444012AGY-C85X-MJH-A with alternatives
Compare STK14CB16-RF25I with alternatives