UPD44324095F5-E50-EQ2
vs
UPD44324095F5-E50-EQ2-A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NEC ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
BGA,
LBGA, BGA165,11X15,40
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX9
4MX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
2
2
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
SEPARATE
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Seated Height-Max
1.51 mm
Standby Current-Max
0.35 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.6 mA
Compare UPD44324095F5-E50-EQ2 with alternatives
Compare UPD44324095F5-E50-EQ2-A with alternatives