UPD44321361GF-A75Y-A
vs
AS7C251MPFD36A-133TQIN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
QFP
QFP
Package Description
14 X 20 MM, PLASTIC, LQFP-100
LQFP,
Pin Count
100
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
3.8 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e6
e3
Length
20 mm
20 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX36
1MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.6 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
Compare UPD44321361GF-A75Y-A with alternatives
Compare AS7C251MPFD36A-133TQIN with alternatives