UPD442012AGY-BC85X-MJH-A
vs
UPD442012AGY-BB55X-MJH-A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
NEC ELECTRONICS CORP
Part Package Code
TSOP1
TSOP1
Package Description
TSOP1,
TSOP1,
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
55 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3/e6
e3/e6
Length
18 mm
18 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
128KX16
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.2 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
MATTE TIN/TIN BISMUTH
MATTE TIN/TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
10
10
Width
12 mm
12 mm
Base Number Matches
1
1
Compare UPD442012AGY-BC85X-MJH-A with alternatives
Compare UPD442012AGY-BB55X-MJH-A with alternatives