UPD442012AGY-BC10X-MJH-A vs UPD442012AGY-BB55X-MJH-A feature comparison

UPD442012AGY-BC10X-MJH-A NEC Electronics Group

Buy Now Datasheet

UPD442012AGY-BB55X-MJH-A NEC Electronics Group

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NEC ELECTRONICS CORP NEC ELECTRONICS CORP
Part Package Code TSOP1 TSOP1
Package Description TSOP1, TSOP1,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 55 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e6 e3/e6
Length 18 mm 18 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 128KX16 128KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 2.7 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Finish TIN BISMUTH MATTE TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) 260
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) 10

Compare UPD442012AGY-BC10X-MJH-A with alternatives

Compare UPD442012AGY-BB55X-MJH-A with alternatives