UPD442002F9-BB85X-BC1
vs
CY14E102N-BA115XCT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA, BGA48,6X8,30
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
15 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e1
Length
8 mm
10 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
128KX16
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.06 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
6 mm
Base Number Matches
1
1
Package Equivalence Code
BGA48,6X8,30
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.003 A
Supply Current-Max
0.07 mA
Supply Voltage-Nom (Vsup)
5 V
Compare UPD442002F9-BB85X-BC1 with alternatives
Compare CY14E102N-BA115XCT with alternatives