UPD442000AGU-BC85X-9JH-A
vs
WMS128K8-17CMA
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
MICROSEMI CORP
|
| Package Description |
8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-32
|
DIP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
85 ns
|
17 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-CDIP-T32
|
| JESD-609 Code |
e3/e6
|
e0
|
| Length |
11.8 mm
|
42.2 mm
|
| Memory Density |
2097152 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
262144 words
|
131072 words
|
| Number of Words Code |
256000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-55 °C
|
| Organization |
256KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
5.13 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
MATTE TIN/TIN BISMUTH
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8 mm
|
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
32
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
Compare WMS128K8-17CMA with alternatives