UPD44165364AF5-E50-EQ2-A vs CY7C1315BV18-200BZXC feature comparison

UPD44165364AF5-E50-EQ2-A NEC Electronics Group

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CY7C1315BV18-200BZXC Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NEC ELECTRONICS CORP ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description LBGA, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.51 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 2
Pbfree Code Yes
Additional Feature PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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