UPD30550F2-300-NN1
vs
SPC5200CVR466B
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
|
BGA
|
| Package Description |
|
BGA, BGA272,20X20,50
|
| Pin Count |
|
272
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
3A991
|
| HTS Code |
|
8542.31.00.01
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
35 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B272
|
| JESD-609 Code |
|
e1
|
| Length |
|
27 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
272
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA272,20X20,50
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
2.65 mm
|
| Speed |
|
466 MHz
|
| Supply Voltage-Max |
|
1.58 V
|
| Supply Voltage-Min |
|
1.42 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR
|
| Base Number Matches |
|
1
|
|
|
|
Compare SPC5200CVR466B with alternatives