UPD30500S2-200
vs
UPD30500AS2-266
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
NEC ELECTRONICS CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA,
|
LBGA,
|
Pin Count |
272
|
272
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
5 PIPELINE STAGE
|
|
Address Bus Width |
64
|
64
|
Bit Size |
64
|
64
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e1
|
e1
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Speed |
200 MHz
|
266 MHz
|
Supply Voltage-Max |
3.465 V
|
2.7 V
|
Supply Voltage-Min |
3.135 V
|
2.5 V
|
Supply Voltage-Nom |
3.3 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
MOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
10
|
10
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare UPD30500S2-200 with alternatives
Compare UPD30500AS2-266 with alternatives