UPD30500AS2-250
vs
IDT79RV5000267BS272
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
272
272
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width
64
64
Bit Size
64
64
Boundary Scan
NO
YES
Clock Frequency-Max
100 MHz
125 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
NO
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e0
Length
29 mm
29 mm
Low Power Mode
YES
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.65 mm
Speed
250 MHz
267 MHz
Supply Voltage-Max
2.625 V
3.465 V
Supply Voltage-Min
2.375 V
3.135 V
Supply Voltage-Nom
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
10
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare UPD30500AS2-250 with alternatives
Compare IDT79RV5000267BS272 with alternatives