UPD29F064115F9-DB80X-CD6
vs
NAND01GR4A1CZA6E
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
STMICROELECTRONICS
|
Package Description |
,
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
63
|
Access Time-Max |
|
15000 ns
|
JESD-30 Code |
|
R-PBGA-B63
|
JESD-609 Code |
|
e1
|
Memory Density |
|
1073741824 bit
|
Memory IC Type |
|
FLASH
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Terminals |
|
63
|
Number of Words |
|
67108864 words
|
Number of Words Code |
|
64000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
64MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY
|
Parallel/Serial |
|
PARALLEL
|
Programming Voltage |
|
1.8 V
|
Qualification Status |
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
|
1.95 V
|
Supply Voltage-Min (Vsup) |
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Position |
|
BOTTOM
|
|
|
|
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