UPD29F008ALGZ-B90BX-LKH
vs
M29W008AB90N1TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
STMICROELECTRONICS
Part Package Code
TSOP1
TSOP
Package Description
10 X 20 MM, PLASTIC, REVERSE, TSOP1-40
TSOP1,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PDSO-G40
R-PDSO-G40
Length
18.4 mm
18.4 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
1MX8
1MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1-R
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
10 mm
10 mm
Base Number Matches
1
1
Additional Feature
20 YEARS DATA RETENTION; BOTTOM BOOT BLOCK
Data Retention Time-Min
20
Compare UPD29F008ALGZ-B90BX-LKH with alternatives
Compare M29W008AB90N1TR with alternatives