UPD28C05C-25
vs
X2804ADI-25
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
XICOR INC
Part Package Code
DIP
Package Description
PLASTIC, DIP-24
HERMETIC SEALED, CERDIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
NO
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512X8
512X8
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0001 A
0.06 A
Supply Current-Max
0.05 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
NO
Base Number Matches
2
1
Length
32.07 mm
Output Characteristics
3-STATE
Programming Voltage
5 V
Seated Height-Max
5.72 mm
Width
15.24 mm
Compare UPD28C05C-25 with alternatives
Compare X2804ADI-25 with alternatives