UPD27C256AD-20
vs
NMC27C256BQM200
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T28
R-GDIP-T28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.03 mA
0.02 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Package Description
WDIP, DIP28,.6
Number of Functions
1
Seated Height-Max
5.715 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
15.24 mm
Compare NMC27C256BQM200 with alternatives