UPD17225MC-XXX-5A4
vs
UPD17225MC-XXX-5A4-A
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
NEC ELECTRONICS CORP
Part Package Code
SSOP
SSOP
Package Description
0.300 INCH, PLASTIC, SSOP-30
LSSOP,
Pin Count
30
30
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
4
4
Clock Frequency-Max
8 MHz
8 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G30
R-PDSO-G30
JESD-609 Code
e0
e6
Length
9.85 mm
9.85 mm
Number of I/O Lines
20
20
Number of Terminals
30
30
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
MROM
MROM
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2 V
2 V
Surface Mount
YES
YES
Technology
MOS
MOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
6.1 mm
6.1 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED