UPC8002GR
vs
BU8242F-T1
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
ROHM CO LTD
|
Part Package Code |
SSOP
|
SOIC
|
Package Description |
LSSOP,
|
SOP-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
e3/e2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-30 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.45 mm
|
2.01 mm
|
Supply Current-Max |
2.2 mA
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
TIN/TIN COPPER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
5.4 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Length |
|
12.5 mm
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare UPC8002GR with alternatives
Compare BU8242F-T1 with alternatives